- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPt
- Application: Hybrid IC
- Description: C4774 is a silver/platinum (3:1) conductor paste designed for high leach resistant applications using aluminium nitride substrates. C4774 also has excellent adhesion and solderability.
- Key features: Excellent leach resistance#Excellent solderability#Excellent adhesion on aluminum nitride
- Conductivity: 80-100 at 12 um fired film thickness
- Alloy Ratio: 03:01
C4774
Discuss your solution
Talk to our experts and find the optimal solution for your applications.