- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: Ag
- Application: Hybrid IC
- Description: C8729 (H) is a plateable silver conductor. It exhibits high adhesion. C8729 (H) is an excellent choice for plating applications, such as copper, nickel, etc.
- Key features: Low resistivity#High adhesion#High speed printing#Feed through hole application
- Process Temperature: Fire at 850 °C (peak) for 10-12 minutes, and with a total firing cycle time of c. 30-60 minutes.
- Film Thickness : 10-15 um
- Viscosity: 15-25 Pas (25 °C, D = 100/s)
- Conductivity: On Al2O3≥ 3 dips (235 °C, 10 s each)
- Alloy Ratio: 100
C8729 (H)
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