- Paste Type: End Termination
- Application Method: Dipping
- Substrate: MLCC
- Metal: Ag
- Application: Varistor - MLV, chip, disc
- Description: ET1894 is low firing plateable silver end termination designed for application on to MLV chip components. The rheology is suitable for maching dipping applications.
- Key features: Nickel plateable#Excellent fired film density and adhesion
- Process Temperature: 560-580 °C peak temperature. Dwell time of 5-7 minutes at peak 45 minutes firing cycle.
- Viscosity: 35-45 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
- Alloy Ratio: 100
- Paste Function: Plateable
ET1894
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