- Paste Type: Dielectric / Glaze
- Application Method: Screen Printing
- Substrate: Aluminum Nitride
- Metal: None
- Application: Hybrid IC
- Description: IP9002 is a Pb, Cd, and Ni free low firing green overglaze that is resistant to various plating solutions. It has a low thermal expansion coefficient allowing for applications which utilize aluminum nitride substrates. It is compatible with various Heraeus conductors designed for aluminum nitride.
- Key features: Excellent plating solution resistance#Pinhole free#Low thermal expansion coefficient (CTE)#Chemically durable
- Process Temperature: 500-600 °C peak temperature. Dwell time of 5-7 minutes.
- Film Thickness : 8-12 um
- Viscosity: 60-80 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
- Solids: 76.0 ± 2.0 %
IP9002
Discuss your solution
Talk to our experts and find the optimal solution for your applications.