The mAgic® PE360 Silver Sinter Paste introduces a new benchmark in Large Area Sintering (LAS) pastes, offering enhanced thermal performance compared to traditional soldering methods. Engineered to deliver a highly reliable joint with exceptional thermal conductivity, this paste overcomes the limitations of conventional soldering techniques. Lead-free and halogen-free, the mAgic® PE360 ensures compliance without compromising performance or reliability.
A significant challenge in adopting sintering for module attach applications lies in effectively managing large areas. The new mAgic® PE360 tackles this challenge with its superior workability and drying behavior, minimizing voiding in the paste layer. Its ability to sinter at very low pressure and temperature levels makes it ideal for sintering finished molded modules, simplifying the manufacturing process compared to conventional sinter pastes for die attach.