Connect with Heraeus Electronics to discover groundbreaking advancements in power module attachment with our new large area sintering technology. It promises to elevate your electronic manufacturing processes to the next level with its exceptional performance and efficiency.
The second highlight will be an alternative, silver free, cost effective and highly reliable Si3N4 AMB substrate that fulfils the high requirements on heat dissipation and high-power density for automotive power modules.
Our team of experts will be on hand to provide insights, answer questions, and discuss how our products and innovations can benefit your business.
Get detailed information in our live product presentations at our booth:
Date: June 11, 2024 (Tuesday)
Time: 1:30 p.m
Topic: Application Examples for Large Area Sintering
Speaker: Florian Seifert, Global Product Manager
Date: June 12, 2024 (Wednesday)
Time: 1:30 p.m
Topic: Latest Developments on Silver Free AMB Substrates
Speaker: Olivier Mathieu, Global Product Manager
Date: June 13, 2024 (Thursday)
Time: 10 a.m
Topic: Latest Developments on Silver Free AMB Substrates
Speaker: Olivier Mathieu, Global Product Manager
Or join us at the E-Mobility & Energy Storage Stage:
Date: June 11, 2024 (Tuesday)
Time: 10 a.m
Topic: Ag Free Silicon Nitride AMB Substrates for Automotive Power Module Applications
Speaker: Olivier Mathieu, Global Product Manager
Date: June 12, 2024 (Wednesday)
Time: 10 a.m
Topic: Soldering vs. Sintering for Module Attach Applications
Speaker: Florian Seifert, Global Product Manager
Don't miss this opportunity to be at the forefront of technological advancement in Power Electronics. Let's meet in hall 6, stand 310 and embark on a journey towards a future of innovation and success together!
